The photolithography is in use to describe the set of operation for achieving a manufacturing process with the transfer of a pattern by light in a photo-sensitive resist. These photoresists are used to cover a part of the substrate for a subsequent process.
We are talking about non-permanent photosensitive resists often also called protective layers (or mask), stencil layers or molds. The processes that need a photosensitive resist are those:
- Plasma dry etching
- Chemical wet ecthing
- Material deposition (lift-off process)
- Electroplating
- Protective coating ... etc.
Depending on the process, the most suitable resist is chosen; we will mainly take into account its chemical properties, its polarity and its thickness. In addition, there are permanent resists used as end products to fabricate micro-components
(optic, fluidic or mechanics micro objects…). These are negative resist, thin or (very) thick.
But the first step where it all starts is the definition of the design by our optical mask generator. We manufacture a glass-chromium plate which will allow the reproduction in several copies of the patterns on the substrates.
Resource contact:
Laurent ROBERT 03 81 66 66 47 lrobert [at] femto-st.fr |
Personal page: https://www.femto-st.fr/fr/personnel-femto/laurentrobert |
Guillaume JUTZI 03 63 08 26 27 guillaume.jutzi [at] femto-st.fr |
Personal page: https://www.femto-st.fr/fr/personnel-femto/guillaumejutzi |
Optical mask generator
HEIDELBERG MLA150 |
Use: > Optical masks > Direct exposure > Grayscale lithography |
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Semi automatic cleaning system
Solar-Semi QS W300 |
Use: > Mask & wafer cleaner |
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Spin-coater with integrated hot plate
Solar-Semi OC ST22 |
Use: > Photoresists spin coating |
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Automatic spin-coater, baking and developer
ACS 200 GEN3 |
Use: > Adherence promotor > Photoresist coating > Photoresist development |
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Spray Coater
Süss Microtec Alta Spray |
Use: > Conformal resist coating on substrate with high topology |
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UV Double-side alignment system
EVG 620 |
Use: > Top and bottom side alignments > Alignment for bonding |
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DUV Double-side alignment system
EVG 620 |
Use: > Top and bottom side alignments |
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Semi-automatic metrology platform
Süss Microtec DSM8 GEN2 |
Use: > Top & bottom / Top & top Alignment control |
Technical specifications |