Lithography

The photolithography is in use to describe the set of operation for achieving a manufacturing process with the transfer of a pattern by light in a photo-sensitive resist. These photoresists are used to cover a part of the substrate for a subsequent process.

We are talking about non-permanent photosensitive resists often also called protective layers (or mask), stencil layers or molds. The processes that need a photosensitive resist are those:

  • Plasma dry etching
  • Chemical wet ecthing
  • Material deposition (lift-off process)
  • Electroplating
  • Protective coating ... etc.

Depending on the process, the most suitable resist is chosen; we will mainly take into account its chemical properties, its polarity and its thickness. In addition, there are permanent resists used as end products to fabricate micro-components
(optic, fluidic or mechanics micro objects…). These are negative resist, thin or (very) thick.

But the first step where it all starts is the definition of the design by our optical mask generator. We manufacture a glass-chromium plate which will allow the reproduction in several copies of the patterns on the substrates.

 

Resource contact:

Laurent ROBERT
03 81 66 66 47
lrobert [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/laurentrobert
Guillaume JUTZI
03 63 08 26 27
guillaume.jutzi [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/guillaumejutzi

 

Optical mask generator

HEIDELBERG
DWL200
Use:
> Optical masks
> Direct exposure
> 3D photolithography
Technical specifications

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Semi automatic cleaning system

Solar-Semi
QS W300
Use:
> Mask & wafer cleaner
Technical specifications

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Spin-coater with integrated hot plate

Solar-Semi
OC ST22
Use:
> Photoresists spin coating
Technical specifications

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Automatic spin-coater, baking and developer

ACS
200 GEN3
Use:
> Adherence promotor
> Photoresist coating
> Photoresist development
Technical specifications

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Spray Coater

Süss Microtec
Alta Spray
Use:
> Conformal resist coating on substrate with high topology
Technical specifications

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UV Double-side alignment system

EVG
620
Use:
> Top and bottom side alignments
> Alignment for bonding
Technical specifications

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DUV Double-side alignment system

EVG
620
Use:
> Top and bottom side alignments
Technical specifications

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Semi-automatic metrology platform

Süss Microtec
DSM8 GEN2
Use:
> Top & bottom / Top & top Alignment control
Technical specifications