Dicing / Polishing
This resource, located out of clean room merge two complementary thematics, materials precision dicing and lapping/polishing.
- Dicing allows chips separation but also materials structuration via various blades shapes and dicing parameters.
- Polishing improve the surface quality of many materials. It's also possible to reduce sample thickness up to very thin dimensions by hard or soft lapping.
Resource contact:
| Ludovic GAUTHIER-MANUEL 03 63 08 24 36 ludovic.gauthier [at] femto-st.fr | Personal page: https://www.femto-st.fr/fr/personnel-femto/ludovicgauthier |
High Precision Dicing Saw 8"
| Disco DAD 3350 | Use: > Separation & Structuration of chips > Circle cut process |
 | Technical specifications |
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High Precision Dicing Saw 8"
| Disco DAD 3361 | Use: > Separation & Structuration of chips > Circle cut process |
 | Technical specifications |
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Precision lapping & polishing system
| Logitech PM6 | Use: > Optical polishing > Materials thinning |
 | Technical specifications |
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CMP system
| Alpsitec E460 | Use: > Wafer optical polishing > Hard materials process |
 | Technical specifications |
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Die-Matrix expander
| Ultron UH132 | Use: > Dicing tape expander |
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Dicing overview
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Realisations
 Precision dice & polish LiNbO3 ridge |  Thinning and release of glass microlenses |
Layers of LiNbO3 / Si> from thin (≃1 µm) to thick layers (hundred of µm)