Process characterization

Characterization is necessary at various steps of a microfabrication process. With optical, mechanical and electrical measurements, we can verify and improve our device behaviours whereas scanning electron microscopy (SEM) gives a high resolution view of their structure and composition.

 

Resource contact:

Franck CHOLLET
03 63 08 26 22
franck.chollet [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/franckchollet
Marina RASCHETTI
03 63 08 26 56
marina.raschetti [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/marinaraschetti

 

Spectroscopic Ellipsometer

Accurion ParkSystem EP4nanofilmUse:
> Thin film thickness
> Optical constants
> Imaging
Accurion ParkSystem EP4nanofilmTechnical specifications

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Thin layer measurement system

Filmetrics F50-EXRUse:
> Automated film thickness measurment
> Index mapping
Technical specifications

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Surface Profiler

Bruker Dektak XTUse:
> Step and roughness
> 3D mapping
> 2D Stress measurement
Technical specifications

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Fizeau Interferometer

ZYGO Verifire GPI XP/DUse:
> Measurement of surface profile & roughness
Technical specifications

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Wafer surface measurement

CyberTechnologies Vantage 2Use:
> Surface measurement
> Thickness measurement
> Optical profilometry
Technical specifications

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Contact Angle Metrology

GBX MCATUse:
> Dynamic contact angle
> Liquid surface tension
> Wetting hysteresis
Technical specifications

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Thin film stress measurement system

FSM 500 TCUse:
> Stress measurement
> Thermal expansion coef.
> Wafer bow height
Technical specifications

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Environnemental SEM & EDS systems

ThermoFisher Apreo SUse:
> High res. observations
> 3D reconstruction
> Chemical analyses (EDS)
Technical specifications

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MEMS Analyser

Polytec MSA-500Use:
> MEMS/MOEMS dynamical analysis
Technical specifications

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Manual DC probe station

Cascade Microtech MPS150Use:
> Manual probing
> DC parametric test
Technical specifications

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Semi automatic RF probe station

SIGNATONEUse:
> Automated mesurement
> Electrical RF (100kHz to 20GHz)
Technical specifications

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X-Ray photoelectron spectrometry

ThermoScientific Nexsa G2Use:
> Quantitative atomic characterization of a surface (1-10 nm depth)
ThermoScientific Nexsa G2Technical specifications

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CR/Carbon coater

LEICA EM ACE600Use:
> Coating for SEM/FIB observations & EDS analysis
Leica EM ACE600Technical specifications

 

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Characterization overview