Characterization is necessary at various steps of a microfabrication process. With optical, mechanical and electrical measurements, we can verify and improve our device behaviours whereas scanning electron microscopy (SEM) gives a high resolution view of their structure and composition.
Resource contact:
| Franck CHOLLET 03 63 08 26 22 franck.chollet [at] femto-st.fr |
Personal page: https://www.femto-st.fr/fr/personnel-femto/franckchollet |
| Marina RASCHETTI 03 63 08 26 56 marina.raschetti [at] femto-st.fr |
Personal page: https://www.femto-st.fr/fr/personnel-femto/marinaraschetti |
Spectroscopic Ellipsometer
| Jobin Yvon HORIBA UVISEL-NIR |
Use: > Optical measurements > Surface roughness > Material properties |
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Thin layer measurement system
| Filmetrics F50-EXR |
Use: > Automated film thickness measurment > Index mapping |
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Surface Profiler
| Bruker Dektak XTA |
Use: > Step and roughness > 3D mapping > 2D Stress measurement |
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Fizeau Interferometer
| ZYGO Verifire GPI XP/D |
Use: > Measurement of surface profile & roughness |
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Wafer surface measurement
| CyberTechnologies Vantage 2 |
Use: > Surface measurement > Thickness measurement > Optical profilometry |
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Contact Angle Metrology
| GBX MCAT |
Use: > Dynamic contact angle > Liquid surface tension > Wetting hysteresis |
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Thin film stress measurement system
| FSM 500 TC |
Use: > Stress measurement > Thermal expansion coef. > Wafer bow height |
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Environnemental SEM & EDS systems
| ThermoFisher Apreo S |
Use: > High res. observations > 3D reconstruction > Chemical analyses (EDS) |
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MEMS Analyser
| Polytec MSA-500 |
Use: > MEMS/MOEMS dynamical analysis |
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Manual DC probe station
| Cascade Microtech MPS150 |
Use: > Manual probing > DC parametric test |
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Semi automatic RF probe station
| SIGNATONE | Use: > Automated mesurement > Electrical RF (100kHz to 20GHz) |
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Characterization overview
