Characterization is necessary at various steps of a microfabrication process. With optical, mechanical and electrical measurements, we can verify and improve our device behaviours whereas scanning electron microscopy (SEM) gives a high resolution view of their structure and composition.

Resource contact:
| Franck CHOLLET 03 63 08 26 22 franck.chollet [at] femto-st.fr | Personal page: https://www.femto-st.fr/fr/personnel-femto/franckchollet |
| Marina RASCHETTI 03 63 08 26 56 marina.raschetti [at] femto-st.fr | Personal page: https://www.femto-st.fr/fr/personnel-femto/marinaraschetti |

X-ray photoelectron spectrometry
| ThermoScientific Nexsa G2 | Use: > Quantitative atomic characterization of a surface (1-10 nm depth) |
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Spectroscopic Ellipsometer
| Accurion ParkSystems EP4nanofilm | Use: > Thin film thickness > Optical constants > Imaging |
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Thin layer measurement system
| Filmetrics F50-EXR | Use: > Automated film thickness measurment > Index mapping |
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Surface Profiler
| Bruker Dektak XTA | Use: > Step and roughness > 3D mapping > 2D Stress measurement |
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Fizeau Interferometer
| ZYGO Verifire GPI XP/D | Use: > Measurement of surface profile & roughness |
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Wafer surface measurement
| CyberTechnologies Vantage 2 | Use: > Surface measurement > Thickness measurement > Optical profilometry |
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Contact Angle Metrology
| GBX MCAT | Use: > Dynamic contact angle > Liquid surface tension > Wetting hysteresis |
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Thin film stress measurement system
| FSM 500 TC | Use: > Stress measurement > Thermal expansion coef. > Wafer bow height |
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Environnemental SEM & EDS systems
| ThermoFisher Apreo S | Use: > High res. observations > 3D reconstruction > Chemical analyses (EDS) |
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MEMS Analyser
| Polytec MSA-500 | Use: > MEMS/MOEMS dynamical analysis |
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Manual DC probe station
| Cascade Microtech MPS150 | Use: > Manual probing > DC parametric test |
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Semi automatic RF probe station
| SIGNATONE | Use: > Automated mesurement > Electrical RF (100kHz to 20GHz) |
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Characterization overview













