This resource, located out of clean room merge two complementary thematics, materials precision dicing and lapping/polishing.
- Dicing allows chips separation but also materials structuration via various blades shapes and dicing parameters.
- Polishing improve the surface quality of many materials. It's also possible to reduce sample thickness up to very thin dimensions by hard or soft lapping.
Resource contact:
| Ludovic GAUTHIER-MANUEL 03 63 08 24 36 ludovic.gauthier [at] femto-st.fr |
Personal page: https://www.femto-st.fr/fr/personnel-femto/ludovicgauthier |
High Precision Dicing Saw 8"
| Disco DAD 3350 |
Use: > Separation & Structuration of chips > Circle cut process |
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Technical specifications |
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Precision Lapping & Polishing system
| Logitech PM6 |
Use: > Optical polishing > Material thinning |
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Technical specifications |
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CMP system
| Alpsitec E460 |
Use: > Wafer optical polishing > Hard materials process |
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Technical specifications |
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Dicing overview
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Realisations
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> from thin (≃1 µm) to thick layers (hundred of µm)