Dicing / Polishing

This resource, located out of clean room merge two complementary thematics, materials precision dicing and lapping/polishing.

  • Dicing allows chips separation but also materials structuration via various blades shapes and dicing parameters.
  • Polishing improve the surface quality of many materials. It's also possible to reduce sample thickness up to very thin dimensions by hard or soft lapping.

 

Resource contact:

Ludovic GAUTHIER-MANUEL
03 63 08 24 36
ludovic.gauthier [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/ludovicgauthier

 

High Precision Dicing Saw 8"

Disco
DAD 3350
Use:
> Separation & Structuration of chips
> Circle cut process
Technical specifications

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Precision Lapping & Polishing system

Logitech
PM6
Use:
> Optical polishing
> Material thinning
Technical specifications

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CMP system

Alpsitec
E460
Use:
> Wafer optical polishing
> Hard materials process
Technical specifications

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Dicing overview

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Realisations

Precision dice & polish LiNbO3 ridge
Thinning and release of glass microlenses
Layers of LiNbO3 / Si
> from thin (≃1 µm) to thick layers (hundred of µm)