Integration / Packaging

Resource contact:

Sylwester BARGIEL
03 81 66 63 02
sylwester.bargiel [at] femto-st.fr

Personal page: https://www.femto-st.fr/fr/personnel-femto/sylwesterbargiel

 

Megasonic wafer Cleaner & Wafer bonding inspection systems

CL200 & IR200 Use:
> Final rinsing of wafers before bonding (reduction of particles)
Technical specifications

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Plasma Surface activation system

Nanoprep
NP12
Use:
> Surface activation for low-temperature bonding applications
Technical specifications

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Multi-wafer bonder

EVG
501
Use:
> Special bonding process (Anodic, Eutectic, Thermo-Compression, Adhesive & Direct)
Technical specifications

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Multi-wafer bonder

AML
402P
Use:
> Special bonding process (Anodic, Eutectic, Thermo-Compression & Direct)
Technical specifications

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Wafer aligner-bonder 6’’

AML
AWB-04
Use:
> Flexible automatic multi-process system
> No flags clamping
Technical specifications

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Automatic Flip-chip bonder

Süss Microtec
FC250
Use:
> Die to substrate bonding and interconnecting
Technical specifications

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Pick and Place Die Bonder

TPT
HB-70
Use:
> Die bonding
> Assembly of micro-components
Technical specifications

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Semi-Automatic Wire Bonder

TPT
HB-16
Use:
> Wire bonding of electronic components
Technical specifications

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Mechanical micro bond tester

Nordson
DAGE 4000 Plus
Use:
>Testing of Electrical interconnects & Bonding quality
Technical specifications

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Realisations

Cesium vapor microcell for MEMS atomic clock
Array of glass f=1.9mm lens doublet
(Si-Glass-Si-Glass, anodic bonding)
Monolithically integrated Mirau micro-interferometer
(Si-Glass-Si-Glass, 5.3mm thick, anodic bonding)
Au stud bump flip-chip bonding of glass chips
(1.7x1.7x0.5mm3)
Pick & Place assembled  OCT scanning probe
Vertical electrostatic comb drive actuator
(adhesive bond on PCB and Au wire bonding)
Chip-level mechanical tests of bond quality
(PULL or SHEAR mode)