Nanotechnology

The Mimento facility has a dedicated resource to deal with structures of size below 1 µm. It is mainly composed of 2 high resolution equipments, namely an electron beam lithography station and a dual beam SEM (Scanning Electron Microscope) / FIB (Focused Ion Beam).

The electron beam lithography station is used for the exposition of electron sensitive resists. The feature size is in the range 20 nm - 1 µm and after development, the resist can be used as a mask for lift-off process or dry etching.

The dual beam can be used for different kind of process. The most common is for milling thanks to Ga ions, with a resolution down to 10 nm. It can also be used for local deposition (specific precursors) and for nano-manipulation (nano-robot). Characterization by cross-section (FIB milling and then SEM inspection of the slice) is a standard process and is very helpful for process optimization and MEMS’s behaviour understanding.

 

Resource contact:

Roland SALUT
03 63 08 21 07
roland.salut [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/rolandsalut
Marina RASCHETTI
03 63 08 26 56
marina.raschetti [at] femto-st.fr
Personal page: https://www.femto-st.fr/fr/personnel-femto/marinaraschetti

 

Electron beam lithography system

Raith
E_Line
Use:
> Electronic lithography
Technical specifications

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Focused Ion Beam system

FEI Helios
Nanolab 600i
Use:
> Ion Beam Lithography
> SEM observation
> 3D reconstruction
Technical specifications

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Realisations

E-beam
RIE etching of SiN
E-beam
Aluminium lift-off
FIB
Milling with angle
FIB
3D deposit